Title :
A new fab concept in the 300 mm wafer era
Author :
Koike, Atsuyoshi
Author_Institution :
Trecenti Technol. Inc., Ibaraki, Japan
Abstract :
Trecenti Technologies, Inc. is currently creating the first 300 mm-wafer volume production fab. Our basic objectives are to minimize cycle time with all single-wafer processes and to create a scalable fab that has an optimized expansion unit to satisfy high investment efficiency and flexibility to changing market needs.
Keywords :
VLSI; integrated circuit manufacture; 300 mm; 300 mm wafer; Trecenti Technologies; cycle time; high investment efficiency; market flexibility; optimized expansion unit; scalable fab; semiconductor industry; single-wafer processes; system-on-a-chip; wafer manufacturing; wafer volume production fab; Cost function; Demand forecasting; Electronics industry; Investments; Large-scale systems; Manufacturing; Optimized production technology; Product development; System-on-a-chip; Technological innovation;
Conference_Titel :
Semiconductor Manufacturing, 2000. Proceedings of ISSM 2000. The Ninth International Symposium on
Print_ISBN :
0-7803-7392-8
DOI :
10.1109/ISSM.2000.993613
