DocumentCode
2386232
Title
A Floating Body Cell (FBC) fully Compatible with 90nm CMOS Technology Node for Embedded Applications
Author
Hamamoto, Takeshi ; Minami, Yoshihiro ; Shino, Tomoaki ; Sakamoto, Atsushi ; Higashi, Tomoki ; Kusunoki, Naoki ; Fujita, Katsuyuki ; Hatsuda, Kosuke ; Ohsawa, Takashi ; Aoki, Nobutoshi ; Tanimoto, Hiroyoshi ; Morikado, Mutsuo ; Nakajima, Hiroomi ; Inoh, K
Author_Institution
SoC Res. & Dev. Center, Toshiba Corp., Yokohama
fYear
0
fDate
0-0 0
Firstpage
1
Lastpage
6
Abstract
Floating body cell (FBC) is a one-transistor memory cell on SOI substrate, which aims high density embedded memory on SOC. In order to verify this memory cell technology, a 128Mb SOI DRAM with FBC has been designed and successfully developed. The memory cell design and the experimental results, such as the signal and the retention characteristics, are reviewed. The results of the fabricated SOI DRAM and the prospect as embedded memory are also discussed
Keywords
CMOS memory circuits; DRAM chips; embedded systems; silicon-on-insulator; 90 nm; CMOS technology; SOI DRAM; SOI substrate; floating body cell; high density embedded memory; one-transistor memory cell; CMOS process; CMOS technology; Fabrication; Large scale integration; MOSFET circuits; Microelectronics; Random access memory; Research and development; Signal design; Wiring;
fLanguage
English
Publisher
ieee
Conference_Titel
Integrated Circuit Design and Technology, 2006. ICICDT '06. 2006 IEEE International Conference on
Conference_Location
Padova
Print_ISBN
1-4244-0097-X
Type
conf
DOI
10.1109/ICICDT.2006.220785
Filename
1669372
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