• DocumentCode
    2386823
  • Title

    Polymer self assembly in semiconductor microelectronics

  • Author

    Black, C.T. ; Guarini, K.W. ; Ruiz, R. ; Sikorski, E.M. ; Babich, I.V. ; Sandstrom, R.L. ; Zhang, Y.

  • Author_Institution
    IBM T. J. Watson Res. Center, Yorktown Heights, NY
  • fYear
    2006
  • fDate
    11-13 Dec. 2006
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    Integration of polymer self assembly with semiconductor processing enables sub-lithographic patterning of integrated circuit (IC) device elements and offers a non-traditional pathway to performance improvements (Black, 2005). We discuss target applications including surface-roughening for on-chip decoupling capacitors (Black et al., 2004), patterning nanocrystal floating gates for FLASH devices (Guarini et al., 2003), and defining FET channel arrays (Black, 2005)
  • Keywords
    integrated circuits; lithography; microassembling; FET channel arrays; FLASH devices; integrated circuit device elements; on-chip decoupling capacitors; patterning nanocrystal floating gates; polymer self assembly; semiconductor microelectronics; sub-lithographic patterning; surface-roughening; Capacitors; FETs; Microelectronics; Nanocrystals; Pattern formation; Polymers; Rough surfaces; Self-assembly; Semiconductor materials; Surface roughness;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electron Devices Meeting, 2006. IEDM '06. International
  • Conference_Location
    San Francisco, CA
  • Print_ISBN
    1-4244-0438-X
  • Electronic_ISBN
    1-4244-0439-8
  • Type

    conf

  • DOI
    10.1109/IEDM.2006.346806
  • Filename
    4154225
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2386823