• DocumentCode
    2386995
  • Title

    How do material and information flows impact fab performance?

  • Author

    Scott, Douglas

  • Author_Institution
    PRI Autom., Billerica, MA, USA
  • fYear
    2000
  • fDate
    2000
  • Firstpage
    233
  • Lastpage
    236
  • Abstract
    Historically, a lot of attention has been given to improving the physics, the chemistry and the process technologies used in semiconductor manufacturing. This focus has produced dramatic results. Since its inception, the semiconductor industry has achieved productivity improvements unmatched by any other industry. Shrinking feature sizes, larger wafers, yield improvements and other productivity gains have contributed to this success. However, most of the known technological capabilities will be approaching or have reached their limits within 10-15 years. Already, larger wafers and improved yields are making a smaller contribution to productivity improvements than they have in the past, creating a widening gap in the productivity curve. This paper discusses how automated material and information flow can help close this gap in the productivity curve, and results that have been achieved
  • Keywords
    integrated circuit manufacture; process control; production control; automated material-information flow; feature size; productivity gains; productivity improvements; semiconductor industry; semiconductor manufacturing; wafer size; yield improvements; Chemistry; Logistics; Manufacturing automation; Manufacturing industries; Manufacturing processes; Physics; Production facilities; Productivity; Semiconductor device manufacture; Semiconductor materials;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Semiconductor Manufacturing, 2000. Proceedings of ISSM 2000. The Ninth International Symposium on
  • Conference_Location
    Tokyo
  • ISSN
    1523-553X
  • Print_ISBN
    0-7803-7392-8
  • Type

    conf

  • DOI
    10.1109/ISSM.2000.993656
  • Filename
    993656