DocumentCode
2386995
Title
How do material and information flows impact fab performance?
Author
Scott, Douglas
Author_Institution
PRI Autom., Billerica, MA, USA
fYear
2000
fDate
2000
Firstpage
233
Lastpage
236
Abstract
Historically, a lot of attention has been given to improving the physics, the chemistry and the process technologies used in semiconductor manufacturing. This focus has produced dramatic results. Since its inception, the semiconductor industry has achieved productivity improvements unmatched by any other industry. Shrinking feature sizes, larger wafers, yield improvements and other productivity gains have contributed to this success. However, most of the known technological capabilities will be approaching or have reached their limits within 10-15 years. Already, larger wafers and improved yields are making a smaller contribution to productivity improvements than they have in the past, creating a widening gap in the productivity curve. This paper discusses how automated material and information flow can help close this gap in the productivity curve, and results that have been achieved
Keywords
integrated circuit manufacture; process control; production control; automated material-information flow; feature size; productivity gains; productivity improvements; semiconductor industry; semiconductor manufacturing; wafer size; yield improvements; Chemistry; Logistics; Manufacturing automation; Manufacturing industries; Manufacturing processes; Physics; Production facilities; Productivity; Semiconductor device manufacture; Semiconductor materials;
fLanguage
English
Publisher
ieee
Conference_Titel
Semiconductor Manufacturing, 2000. Proceedings of ISSM 2000. The Ninth International Symposium on
Conference_Location
Tokyo
ISSN
1523-553X
Print_ISBN
0-7803-7392-8
Type
conf
DOI
10.1109/ISSM.2000.993656
Filename
993656
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