• DocumentCode
    2387202
  • Title

    High efficiency airborne molecular contaminants removal technology by a new cooled-type 2-stage high-speed air washer method

  • Author

    Wakamatsu, Hidetoshi ; Matsuki, Mikio ; Tanaka, Norio ; Ogata, Hiroshi ; Iba, Hiroo ; Murata, Koichi

  • Author_Institution
    Oki Electr. Ind. Co. Ltd., Tokyo, Japan
  • fYear
    2000
  • fDate
    2000
  • Firstpage
    289
  • Lastpage
    292
  • Abstract
    We have developed a new cooled-type 2-stage high-speed air washer treating technique to remove the high-concentration airborne molecular contaminants (AMC) in the outside air. This technique was applied in an air-conditioning system to treat the intake air of the clean room. The new air conditioning system can treat the AMC to a sufficiently lower concentration, which does not influence a semiconductor manufacturing process. By a new B-factor analysis, the effectiveness of the 1st-stage of the cooling condensation coil was found and the chemical ion removal mechanism of the new system was solved. The new system can remove both chemical contaminants of the water-solube and water-insolube variety. This new system can operate at almost the same initial and running costs as the conventional air-conditioning system without chemical contaminant countermeasures
  • Keywords
    air conditioning; clean rooms; AMC; B-factor analysis; air-conditioning system; airborne molecular contaminants removal; chemical contaminant removal; chemical ion removal mechanism; clean room; cooled-type 2-stage high-speed air washer method; cooling condensation coil; semiconductor manufacturing; Chemical analysis; Chemical processes; Coils; Cooling; Costs; Filtering; Filters; Manufacturing processes; Production facilities; Semiconductor device manufacture;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Semiconductor Manufacturing, 2000. Proceedings of ISSM 2000. The Ninth International Symposium on
  • Conference_Location
    Tokyo
  • ISSN
    1523-553X
  • Print_ISBN
    0-7803-7392-8
  • Type

    conf

  • DOI
    10.1109/ISSM.2000.993670
  • Filename
    993670