Title :
Energy saving in semiconductor fabs by out-air handling unit performance improvement
Author :
Suzuki, Hirokazu ; Hanaoka, Hideo ; Ohkubo, Yoshinori ; Yamazaki, Yoshio ; Shirai, Yasuyuki ; Ohmi, Tadahiro
Author_Institution :
Dept. of Electr. Eng., Tohoku Univ., Sendai, Japan
Abstract :
We shows methods of energy saving. The energy consumed in semiconductor fabs is classified into two categories, the manufacturing system and the air conditioning. The energy for the air conditioning is further classified into fresh air intake, recirculation (clean room) air conditioning and cooling system of the manufacturing system. The moisture in the fresh air is condensed on a heat exchange-fin of the air-handling unit (AHU). This condensation decreases thermal exchange and increases intake-air resistance and removal of it improves the performance. So we removed it, and 24% improvement of coefficient of heat exchange is achieved. Using this result, a 5% energy saving of the refrigerator is obtained. If the result is applied to all of the heating, ventilation, and air conditioning (HVAC) system, 3% energy saving is obtained
Keywords :
HVAC; air conditioning; condensation; heat exchangers; air conditioning; air-handling unit; condensation; energy saving; heat exchange coefficient; intake-air resistance; manufacturing system; out-air handling unit performance improvement; semiconductor fabs; thermal exchange; Air conditioning; Aluminum; Coolants; Cooling; Copper; Manufacturing systems; Power engineering and energy; Refrigeration; Thermal conductivity; Thermal management;
Conference_Titel :
Semiconductor Manufacturing, 2000. Proceedings of ISSM 2000. The Ninth International Symposium on
Conference_Location :
Tokyo
Print_ISBN :
0-7803-7392-8
DOI :
10.1109/ISSM.2000.993671