DocumentCode
2387345
Title
Insertion of a three dimensional silicon microelectrode assembly through a thick meningeal membrane
Author
Escamilla-Mackert, T. ; Langhals, Nicholas B. ; Kozai, Takashi D Y ; Kipke, Daryl R.
Author_Institution
Dept. of Biomed. Eng., Univ. of Michigan, Ann Arbor, MI, USA
fYear
2009
fDate
3-6 Sept. 2009
Firstpage
1616
Lastpage
1618
Abstract
There are many different needs for intraoperative mapping in both rodent as well as human brain. Whether the goal of the procedure is for epileptic mapping, removal of cancerous tissue, mapping the motor and sensory cortices, or understanding the underlying neural networks within the brain, dense three-dimensional electrode arrays are necessary. In this study, we outlined and validated thicker silicon probe designs for use in intracortical mapping applications. Multiple shank and electrode site configurations were implanted successfully through rat dura as a model for human pia, and all devices maintained the electrical functionality necessary for electrophysiological mapping applications.
Keywords
bioelectric phenomena; brain; microelectrodes; prosthetics; Si; brain; cancerous tissue removal; electrode arrays; electrophysiological mapping; epileptic mapping; human pia; intraoperative mapping; microelectrode insertion; neural networks; rat dura; thick meningeal membrane; Animals; Meninges; Microelectrodes; Rats; Rats, Sprague-Dawley; Silicon;
fLanguage
English
Publisher
ieee
Conference_Titel
Engineering in Medicine and Biology Society, 2009. EMBC 2009. Annual International Conference of the IEEE
Conference_Location
Minneapolis, MN
ISSN
1557-170X
Print_ISBN
978-1-4244-3296-7
Electronic_ISBN
1557-170X
Type
conf
DOI
10.1109/IEMBS.2009.5333221
Filename
5333221
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