DocumentCode :
2387345
Title :
Insertion of a three dimensional silicon microelectrode assembly through a thick meningeal membrane
Author :
Escamilla-Mackert, T. ; Langhals, Nicholas B. ; Kozai, Takashi D Y ; Kipke, Daryl R.
Author_Institution :
Dept. of Biomed. Eng., Univ. of Michigan, Ann Arbor, MI, USA
fYear :
2009
fDate :
3-6 Sept. 2009
Firstpage :
1616
Lastpage :
1618
Abstract :
There are many different needs for intraoperative mapping in both rodent as well as human brain. Whether the goal of the procedure is for epileptic mapping, removal of cancerous tissue, mapping the motor and sensory cortices, or understanding the underlying neural networks within the brain, dense three-dimensional electrode arrays are necessary. In this study, we outlined and validated thicker silicon probe designs for use in intracortical mapping applications. Multiple shank and electrode site configurations were implanted successfully through rat dura as a model for human pia, and all devices maintained the electrical functionality necessary for electrophysiological mapping applications.
Keywords :
bioelectric phenomena; brain; microelectrodes; prosthetics; Si; brain; cancerous tissue removal; electrode arrays; electrophysiological mapping; epileptic mapping; human pia; intraoperative mapping; microelectrode insertion; neural networks; rat dura; thick meningeal membrane; Animals; Meninges; Microelectrodes; Rats; Rats, Sprague-Dawley; Silicon;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Engineering in Medicine and Biology Society, 2009. EMBC 2009. Annual International Conference of the IEEE
Conference_Location :
Minneapolis, MN
ISSN :
1557-170X
Print_ISBN :
978-1-4244-3296-7
Electronic_ISBN :
1557-170X
Type :
conf
DOI :
10.1109/IEMBS.2009.5333221
Filename :
5333221
Link To Document :
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