• DocumentCode
    2387345
  • Title

    Insertion of a three dimensional silicon microelectrode assembly through a thick meningeal membrane

  • Author

    Escamilla-Mackert, T. ; Langhals, Nicholas B. ; Kozai, Takashi D Y ; Kipke, Daryl R.

  • Author_Institution
    Dept. of Biomed. Eng., Univ. of Michigan, Ann Arbor, MI, USA
  • fYear
    2009
  • fDate
    3-6 Sept. 2009
  • Firstpage
    1616
  • Lastpage
    1618
  • Abstract
    There are many different needs for intraoperative mapping in both rodent as well as human brain. Whether the goal of the procedure is for epileptic mapping, removal of cancerous tissue, mapping the motor and sensory cortices, or understanding the underlying neural networks within the brain, dense three-dimensional electrode arrays are necessary. In this study, we outlined and validated thicker silicon probe designs for use in intracortical mapping applications. Multiple shank and electrode site configurations were implanted successfully through rat dura as a model for human pia, and all devices maintained the electrical functionality necessary for electrophysiological mapping applications.
  • Keywords
    bioelectric phenomena; brain; microelectrodes; prosthetics; Si; brain; cancerous tissue removal; electrode arrays; electrophysiological mapping; epileptic mapping; human pia; intraoperative mapping; microelectrode insertion; neural networks; rat dura; thick meningeal membrane; Animals; Meninges; Microelectrodes; Rats; Rats, Sprague-Dawley; Silicon;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Engineering in Medicine and Biology Society, 2009. EMBC 2009. Annual International Conference of the IEEE
  • Conference_Location
    Minneapolis, MN
  • ISSN
    1557-170X
  • Print_ISBN
    978-1-4244-3296-7
  • Electronic_ISBN
    1557-170X
  • Type

    conf

  • DOI
    10.1109/IEMBS.2009.5333221
  • Filename
    5333221