DocumentCode :
2387729
Title :
Floating Body Cell with Independently-Controlled Double Gates for High Density Memory
Author :
Ban, Ibrahim ; Avci, Uygar E. ; Shah, Uday ; Barns, Chris E. ; Kencke, David L. ; Chang, Peter
Author_Institution :
Technol. Manuf. Group, Intel Corp., Hillsboro, OR
fYear :
2006
fDate :
11-13 Dec. 2006
Firstpage :
1
Lastpage :
4
Abstract :
An aggressively scaled, self-aligned, independently controlled double-gate floating body cell (IDG FBC) is reported. This structure eases the scaling constraints of other FBC memory devices proposed to date. Enhanced memory performance has been demonstrated owing to the independent back gate with thin oxide and thin Si fin. Memory devices with 85-nm Lg and 30-nm fin widths (Z) have been shown to exhibit better memory characteristics at a lower voltage than alternative FBC structures at comparable dimensions. Design, fabrication, operation, and scalability of IDG FBC devices are discussed
Keywords :
DRAM chips; nanoelectronics; silicon-on-insulator; 30 nm; 85 nm; DRAM chips; floating body cell; high density memory; silicon-on-insulator; Doping; Fabrication; Low voltage; Manufacturing processes; Potential well; Random access memory; Resource description framework; Scalability; Threshold voltage; Virtual manufacturing;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electron Devices Meeting, 2006. IEDM '06. International
Conference_Location :
San Francisco, CA
Print_ISBN :
1-4244-0439-8
Electronic_ISBN :
1-4244-0439-8
Type :
conf
DOI :
10.1109/IEDM.2006.346847
Filename :
4154266
Link To Document :
بازگشت