DocumentCode :
2387865
Title :
Electrical Characterization of Residual Bulk Defects after Laser Annealing of Implanted Shallow Junctions
Author :
Liu, S. ; Gonda, V. ; Scholtes, T.L.M. ; Nanver, L.K.
Author_Institution :
Delft Univ. of Technol.
fYear :
0
fDate :
0-0 0
Firstpage :
112
Lastpage :
115
Abstract :
A set of circular ring-gate JFET test structures has been designed with which differential measurements can be utilized to electrically investigate the residual defects after the ELA (excimer laser annealing) of implanted shallow junctions. The implanted ELA junction forms the top gate of the JFET and the diode I-V characteristics, sheet resistance and capacitance of the laterally uniform region below this gate, as well as the characteristics of the underlying pn junction formed between the bottom-gate and the source-channel-drain region can be determined. The measurements are used to evaluate the influence of various implantation parameters and laser energies on the residual defects associated with the shallow junction formation
Keywords :
capacitance; electric resistance; electric resistance measurement; ion implantation; junction gate field effect transistors; laser beam annealing; p-n junctions; semiconductor device measurement; semiconductor diodes; capacitance; circular ring-gate JFET test structures; differential measurements; diode; excimer laser annealing; implantation parameters; implanted shallow junctions; laser energies; pn junction; residual bulk defects; sheet resistance; Annealing; Capacitance; Diodes; Electric resistance; Electric variables measurement; Electrical resistance measurement; Energy measurement; Optical design; Ring lasers; Testing;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Junction Technology, 2006. IWJT '06. International Workshop on
Conference_Location :
Shanghai
Print_ISBN :
1-4244-0047-3
Type :
conf
DOI :
10.1109/IWJT.2006.220873
Filename :
1669460
Link To Document :
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