Author :
Mise, N. ; Watanabe, Yoshihiro ; Migita, S. ; Nabatame, T. ; Satake, Hiroshi ; Toriumi, A.
Author_Institution :
MIRAI-ASET, AIST, Tsukuba
Abstract :
Self-organized (111) faceted NiSi2 source and drain structure with segregated dopants in the NiSi2/Si interfaces has been proposed for aggressively scaled SOI MOSFETs. The advantages of this source and drain structure are a superior short-channel effect (SCE) immunity and a very small parasitic resistance. The SCE is suppressed by a trapezoidal shape of the channel and by a small variation in the channel length that is obtained thanks to the epitaxial growth of NiSi2 on Si. The significant effects of the channel shape and the variation-free channel length are also confirmed by the numerical simulation. Owing to the low-temperature annealing at 600degC for NiSi2 formation and dopants activation, wider selections of gate metal and high-k gate dielectric are possible. Moreover, NiSi2 is the most Si-rich phase among nickel silicides family and thermally stable. Self-organized (111) faceted NiSi 2 source/drain structure is thus quite promising for future CMOS devices
Keywords :
MOSFET; annealing; electric resistance; epitaxial growth; nickel compounds; self-assembly; silicon-on-insulator; 600 degC; CMOS devices; NiSi2-Si; SOI MOSFET; channel length; epitaxial growth; gate metal; high-k gate dielectric; low-temperature annealing; nickel silicides; parasitic resistance; segregated dopants; self-organized faceted drain; self-organized faceted source; short-channel effect; Annealing; Buildings; High K dielectric materials; MOSFETs; Nickel; Schottky barriers; Shape; Silicides; Silicon; Thyristors;
Conference_Titel :
Junction Technology, 2006. IWJT '06. International Workshop on
Conference_Location :
Shanghai
Print_ISBN :
1-4244-0047-3
DOI :
10.1109/IWJT.2006.220885