DocumentCode :
2389208
Title :
Hollow polymer microneedle array fabricated by photolithography process combined with micromolding technique
Author :
Wang, Po-Chun ; Wester, Brock A. ; Rajaraman, Swaminathan ; Paik, Seung-Joon ; Kim, Seong-Hyok ; Allen, Mark G.
Author_Institution :
Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
fYear :
2009
fDate :
3-6 Sept. 2009
Firstpage :
7026
Lastpage :
7029
Abstract :
Transdermal drug delivery through microneedles is a minimally invasive procedure causing little or no pain, and is a potentially attractive alternative to intramuscular and subdermal drug delivery methods. This paper demonstrates the fabrication of a hollow microneedle array using a polymer-based process combining UV photolithography and replica molding techniques. The key characteristic of the proposed fabrication process is to define a hollow lumen for microfluidic access via photopatterning, allowing a batch process as well as high throughput. A hollow SU-8 microneedle array, consisting of 825 mum tall and 400 mum wide microneedles with 15-25 mum tip diameters and 120 mum diameter hollow lumens was designed, fabricated and characterized.
Keywords :
bioMEMS; drug delivery systems; microfabrication; microfluidics; moulding; needles; polymers; skin; soft lithography; ultraviolet lithography; SU-8 microneedle array design; UV photolithography; batch process; hollow polymer microneedle array fabrication; microfluidics; micromolding technique; minimally invasive procedure; photolithography process; photopatterning; polymer-based process; replica molding techniques; size 120 mum; size 15 mum to 25 mum; size 400 mum; size 825 mum; transdermal drug delivery; Administration, Cutaneous; Biomedical Engineering; Drug Delivery Systems; Equipment Design; Microfluidic Analytical Techniques; Needles; Photography; Polymers;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Engineering in Medicine and Biology Society, 2009. EMBC 2009. Annual International Conference of the IEEE
Conference_Location :
Minneapolis, MN
ISSN :
1557-170X
Print_ISBN :
978-1-4244-3296-7
Electronic_ISBN :
1557-170X
Type :
conf
DOI :
10.1109/IEMBS.2009.5333317
Filename :
5333317
Link To Document :
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