UHF RFID transponder with miniaturized packaging and interconnection

This paper presents the design and demonstration of UHF RFID tags based on commercial chips with wafer-level packaging and direct die-to-wire interconnection. The packaging and connection technology is presented and shown to have the potential to be a low-cost industrial process. The performances of the processed dies are characterized and compared to a standard wirebonding technology, showing no significant difference. Finally, several tags are demonstrated and exhibit read range performances in good agreement with the theory.