DocumentCode
2390102
Title
ESD-induced internal core device failure: new failure modes in system-on-chip (SOC) designs
Author
Huh, Yoon ; Bendix, Peter ; Min, Kyungjin ; Chen, Jau-Wen ; Narayan, Ravindra ; Johnson, Larry D. ; Voldman, Steven H.
Author_Institution
Global Technol. Leader, Santa Clara, CA, USA
fYear
2005
fDate
20-24 July 2005
Firstpage
47
Lastpage
53
Abstract
With MOSFET scaling, increased design complexity, and multiple system power domains, ESD failures occur in internal core areas which are not connected to external package pins. A review of the various internal core device failure mechanisms and design recommendations are presented.
Keywords
electrostatic discharge; integrated circuit design; integrated circuit reliability; system-on-chip; ESD failures; electrostatic discharge; internal core device failure; system-on-chip design; Databases; Driver circuits; Electrostatic discharge; Lead compounds; Rails; Signal design; Stress; System-on-a-chip; Variable structure systems; Voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
System-on-Chip for Real-Time Applications, 2005. Proceedings. Fifth International Workshop on
Print_ISBN
0-7695-2403-6
Type
conf
DOI
10.1109/IWSOC.2005.58
Filename
1530914
Link To Document