Title :
2001 IEEE International Integrated Reliability Workshop. Final Report (Cat. No.01TH8580)
Abstract :
The following topics are dealt with: microelectronic reliability; semiconductor reliability; customer product reliability requirements; contributors to failure; wafer-level reliability; gate oxide reliability; burn-in; electromigration
Keywords :
reliability; burn-in; electromigration; gate oxide reliability; microelectronic reliability; semiconductor reliability; wafer-level reliability;
Conference_Titel :
Integrated Reliability Workshop Final Report, 2001. 2001 IEEE International
Conference_Location :
Lake Tahoe, CA, USA
Print_ISBN :
0-7803-7167-4
DOI :
10.1109/IRWS.2001.993907
