DocumentCode
2390109
Title
2001 IEEE International Integrated Reliability Workshop. Final Report (Cat. No.01TH8580)
fYear
2001
fDate
15-18 Oct. 2001
Abstract
The following topics are dealt with: microelectronic reliability; semiconductor reliability; customer product reliability requirements; contributors to failure; wafer-level reliability; gate oxide reliability; burn-in; electromigration
Keywords
reliability; burn-in; electromigration; gate oxide reliability; microelectronic reliability; semiconductor reliability; wafer-level reliability;
fLanguage
English
Publisher
ieee
Conference_Titel
Integrated Reliability Workshop Final Report, 2001. 2001 IEEE International
Conference_Location
Lake Tahoe, CA, USA
Print_ISBN
0-7803-7167-4
Type
conf
DOI
10.1109/IRWS.2001.993907
Filename
993907
Link To Document