DocumentCode
2390140
Title
Leakage current variability in nanometer technologies
Author
Anis, Mohab ; Aburahma, Mohamed H.
Author_Institution
Electr. & Comput. Eng., Waterloo Univ., Ont., Canada
fYear
2005
fDate
20-24 July 2005
Firstpage
60
Lastpage
63
Abstract
The dramatic increase in leakage current coupled with the large increase in variability in highly scaled CMOS technologies, pose a major challenge for future IC design. Leakage variability can not be neglected any more, due to the increase of leakage power percentage in modern ICs. In this paper, the main sources of variations and how they impact leakage current are discussed. Design guidelines to reduce variability based on several leakage reduction techniques are also presented. It is shown that reverse body bias technique increases leakage variability due to its deteriorating effect on drain-induced barrier lowering (DIBL). This paper highlights the need for further efforts in the area of statistical leakage estimation, as well as variation tolerant circuit techniques.
Keywords
CMOS integrated circuits; fault tolerance; integrated circuit design; leakage currents; nanoelectronics; drain-induced barrier lowering; integrated circuit design; leakage current variability; leakage reduction techniques; nanometer technologies; reverse body bias technique; variation tolerant circuit techniques; CMOS integrated circuits; CMOS technology; Delay; Design engineering; Frequency; Guidelines; Leakage current; Power engineering and energy; Semiconductor device measurement; Subthreshold current;
fLanguage
English
Publisher
ieee
Conference_Titel
System-on-Chip for Real-Time Applications, 2005. Proceedings. Fifth International Workshop on
Print_ISBN
0-7695-2403-6
Type
conf
DOI
10.1109/IWSOC.2005.78
Filename
1530916
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