• DocumentCode
    2390486
  • Title

    The influence of temperature gradients in isothermal electromigration tests

  • Author

    Leong, Andrew Yap Kin ; Turner, Timothy E.

  • Author_Institution
    Chartered Semiconductor
  • fYear
    2001
  • fDate
    15-18 Oct. 2001
  • Firstpage
    91
  • Lastpage
    93
  • Abstract
    Temperature gradients exist at the ends of metal lines subjected to highly accelerated electromigration tests (e.g. Isothermal Test). These temperature gradients introduce a flux divergence that will impact the time to failure of a metal line. The impacts of such gradients are not modeled in Black´s equation. Thus the failure to consider these effects will lead to incorrect analysis of highly accelerated test results. This paper will show data which clearly illustrates the impact of temperature gradients during the Isothermal test
  • Keywords
    Electrical resistance measurement; Electromigration; Equations; Failure analysis; Isothermal processes; Life estimation; Metals industry; Stress measurement; Temperature; Testing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Integrated Reliability Workshop Final Report, 2001. 2001 IEEE International
  • Conference_Location
    Lake Tahoe, CA, USA
  • Print_ISBN
    0-7803-7167-4
  • Type

    conf

  • DOI
    10.1109/IRWS.2001.993926
  • Filename
    993926