DocumentCode :
2390486
Title :
The influence of temperature gradients in isothermal electromigration tests
Author :
Leong, Andrew Yap Kin ; Turner, Timothy E.
Author_Institution :
Chartered Semiconductor
fYear :
2001
fDate :
15-18 Oct. 2001
Firstpage :
91
Lastpage :
93
Abstract :
Temperature gradients exist at the ends of metal lines subjected to highly accelerated electromigration tests (e.g. Isothermal Test). These temperature gradients introduce a flux divergence that will impact the time to failure of a metal line. The impacts of such gradients are not modeled in Black´s equation. Thus the failure to consider these effects will lead to incorrect analysis of highly accelerated test results. This paper will show data which clearly illustrates the impact of temperature gradients during the Isothermal test
Keywords :
Electrical resistance measurement; Electromigration; Equations; Failure analysis; Isothermal processes; Life estimation; Metals industry; Stress measurement; Temperature; Testing;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Integrated Reliability Workshop Final Report, 2001. 2001 IEEE International
Conference_Location :
Lake Tahoe, CA, USA
Print_ISBN :
0-7803-7167-4
Type :
conf
DOI :
10.1109/IRWS.2001.993926
Filename :
993926
Link To Document :
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