Title :
A reliable die attach method for high power semiconductor lasers and optical amplifiers
Author :
Merritt, S.A. ; Heim, P.J.S. ; Cho, S. ; Dagenais, M.
Author_Institution :
Dept. of Electr. Eng., Maryland Univ., College Park, MD, USA
Abstract :
We have developed a reliable, high yield, void-free method for soldering high power semiconductor laser diodes epitaxy-side down. We have consistently obtained absolute thermal resistances as low at 1.5°C/Watt and specific thermal resistances of 4·10-3 K·cm2/Watt on oxygen-free high conductivity (OFHC) copper heatsinks. This method has very wide process margins (75°C), exhibits excellent repeatability (4%), and is suitable for laser die attach to diamond submounts
Keywords :
chemical interdiffusion; heat sinks; microassembling; semiconductor lasers; soldering; thermal resistance; C; Cu; diamond submounts; die attach method; high power semiconductor lasers; high yield method; optical amplifiers; oxygen-free high conductivity Cu heatsinks; soldering; thermal resistance; void-free method; Copper; Diode lasers; Heat sinks; Microassembly; Power lasers; Semiconductor device reliability; Semiconductor lasers; Soldering; Thermal conductivity; Thermal resistance;
Conference_Titel :
Electronic Components and Technology Conference, 1995. Proceedings., 45th
Conference_Location :
Las Vegas, NV
Print_ISBN :
0-7803-2736-5
DOI :
10.1109/ECTC.1995.515316
