DocumentCode
2390877
Title
Surface features of polymer and ceramic microstructured parts manufactured by micro injection molding
Author
Zhang, K.F. ; Lu, Zhen
Author_Institution
Nat. Key Lab. for Precision Hot Process. of Metal, Harbin Inst. of Technol., Harbin
fYear
2008
fDate
9-11 April 2008
Firstpage
212
Lastpage
217
Abstract
Microstructures are produced respectively by polymer and powder micro injection molding under different process conditions. Two different types of mold insert are designed and manufactured by ICP etching: one with exhaust passage and the other with micro blind hole. This paper investigates the effects of injection parameters, mold vacuum, and silicon mold on the surface quality of polymer microstructures and ceramic green parts. The effects of powder content and sinter temperature on the surface roughness of ZrO2 microstructures are also studied Investigation indicates that inappropriate injection conditions will induce rough and cured surface with cavity. The surface quality of micro structures will improve obviously if the mold is vacuumed before the injection stage. The roughness of etched silicon mold surface is about 0.31 mum. These completely filled polymer microstructures and ZrO2 green parts have approximately same roughness with the silicon mold. If microcavities were filled completely, the effects of injection pressure, mold temperature and holding time on the surface roughness of polymer and ceramic green microstructures is not obvious. Sub-micron ZrO2 powder could improve the surface roughness of sintered ceramic microstructures.
Keywords
ceramics; elemental semiconductors; injection moulding; polymers; silicon; sintering; sputter etching; surface roughness; zirconium compounds; ICP etching; Si; ZrO2; injection parameters; micro blind hole; micro injection molding; microcavities; mold temperature; mold vacuum; polymer microstructures; surface roughness; Ceramics; Etching; Injection molding; Manufacturing; Microstructure; Polymers; Powders; Rough surfaces; Silicon; Surface roughness;
fLanguage
English
Publisher
ieee
Conference_Titel
Design, Test, Integration and Packaging of MEMS/MOEMS, 2008. MEMS/MOEMS 2008. Symposium on
Conference_Location
Nice
Print_ISBN
978-2-35500-006-5
Type
conf
DOI
10.1109/DTIP.2008.4752986
Filename
4752986
Link To Document