• DocumentCode
    2390877
  • Title

    Surface features of polymer and ceramic microstructured parts manufactured by micro injection molding

  • Author

    Zhang, K.F. ; Lu, Zhen

  • Author_Institution
    Nat. Key Lab. for Precision Hot Process. of Metal, Harbin Inst. of Technol., Harbin
  • fYear
    2008
  • fDate
    9-11 April 2008
  • Firstpage
    212
  • Lastpage
    217
  • Abstract
    Microstructures are produced respectively by polymer and powder micro injection molding under different process conditions. Two different types of mold insert are designed and manufactured by ICP etching: one with exhaust passage and the other with micro blind hole. This paper investigates the effects of injection parameters, mold vacuum, and silicon mold on the surface quality of polymer microstructures and ceramic green parts. The effects of powder content and sinter temperature on the surface roughness of ZrO2 microstructures are also studied Investigation indicates that inappropriate injection conditions will induce rough and cured surface with cavity. The surface quality of micro structures will improve obviously if the mold is vacuumed before the injection stage. The roughness of etched silicon mold surface is about 0.31 mum. These completely filled polymer microstructures and ZrO2 green parts have approximately same roughness with the silicon mold. If microcavities were filled completely, the effects of injection pressure, mold temperature and holding time on the surface roughness of polymer and ceramic green microstructures is not obvious. Sub-micron ZrO2 powder could improve the surface roughness of sintered ceramic microstructures.
  • Keywords
    ceramics; elemental semiconductors; injection moulding; polymers; silicon; sintering; sputter etching; surface roughness; zirconium compounds; ICP etching; Si; ZrO2; injection parameters; micro blind hole; micro injection molding; microcavities; mold temperature; mold vacuum; polymer microstructures; surface roughness; Ceramics; Etching; Injection molding; Manufacturing; Microstructure; Polymers; Powders; Rough surfaces; Silicon; Surface roughness;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Design, Test, Integration and Packaging of MEMS/MOEMS, 2008. MEMS/MOEMS 2008. Symposium on
  • Conference_Location
    Nice
  • Print_ISBN
    978-2-35500-006-5
  • Type

    conf

  • DOI
    10.1109/DTIP.2008.4752986
  • Filename
    4752986