• DocumentCode
    2391029
  • Title

    In-plane bistable nanowire for memory devices

  • Author

    Charlot, B. ; Sun, W. ; Yamashita, K. ; Fujita, H. ; Toshiyoshi, H.

  • Author_Institution
    IES CNRS/UMII, Montpellier
  • fYear
    2008
  • fDate
    9-11 April 2008
  • Firstpage
    254
  • Lastpage
    258
  • Abstract
    We present a micromechanical device designed to be used as a non-volatile mechanical memory. The structure is composed of a suspended slender nanowire (width: 100 nm, thickness: 430 nm, length: 8 to 30 mum) clamped at both ends. Electrodes are placed on each side of the nanowire to 1) actuate the structure during the data writing and erasing mode and 2) determine its position by measuring the capacitive bridge in the reading mode. The structure is patterned by electron beam lithography on a pre-stressed thermally grown silicon dioxide layer. When later released by plasma etching, the stressed material relaxes and the beam buckles by itself to a position of lower energy. These symmetric bistable Euler beams exhibit two stable deformed. This paper presents the microfabrication process and the analysis of the static buckling of nanowires. Snapping of these nanowires from one stable position to another by mechanical or electrical means will also be discussed.
  • Keywords
    buckling; electron beam lithography; nanolithography; nanowires; random-access storage; sputter etching; capacitive bridge; data erasing; data writing; electron beam lithography; microfabrication process; micromechanical device; nonvolatile mechanical memory; plasma etching; prestressed thermally grown silicon dioxide layer; static buckling; suspended slender nanowire; symmetric bistable En; Bridges; Electrodes; Electron beams; Lithography; Micromechanical devices; Nanoscale devices; Nonvolatile memory; Plasma measurements; Position measurement; Writing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Design, Test, Integration and Packaging of MEMS/MOEMS, 2008. MEMS/MOEMS 2008. Symposium on
  • Conference_Location
    Nice
  • Print_ISBN
    978-2-35500-006-5
  • Type

    conf

  • DOI
    10.1109/DTIP.2008.4752995
  • Filename
    4752995