DocumentCode
2391067
Title
An optimal implementation of a superscalar architecture
Author
Andrews, D.L.
Author_Institution
Dept. of Electr. Eng., Arkansas Univ., Fayetteville, AR, USA
fYear
1995
fDate
21-24 May 1995
Firstpage
499
Lastpage
504
Abstract
This paper describes an ongoing research effort at the High Density Electronics Center (HiDEC) and the University of Arkansas for developing optimal system designs based on Multichip Module (MCM) technology. This research effort is focused on developing a high performance superscalar processor architecture designed for use in an MIMD parallel architecture. The architectural tradeoffs performed for developing the superscalar architecture are discussed, including the partitioning of functionality in order to take advantage of the high density, high bandwidth I/O capabilities of MCMs. Results of an analysis study are also presented, showing the performance increase of the optimal MCM based design compared to a traditionally packaged RISC architecture
Keywords
multichip modules; parallel architectures; pipeline processing; MCM technology; MIMD parallel architecture; high bandwidth I/O capabilities; high density; multichip module; optimal MCM based design; optimal implementation; superscalar architecture; Bandwidth; Circuit testing; Integrated circuit interconnections; Multichip modules; Packaging; Parallel architectures; Parallel machines; Performance analysis; Reduced instruction set computing; Silicon;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 1995. Proceedings., 45th
Conference_Location
Las Vegas, NV
Print_ISBN
0-7803-2736-5
Type
conf
DOI
10.1109/ECTC.1995.515327
Filename
515327
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