• DocumentCode
    2391067
  • Title

    An optimal implementation of a superscalar architecture

  • Author

    Andrews, D.L.

  • Author_Institution
    Dept. of Electr. Eng., Arkansas Univ., Fayetteville, AR, USA
  • fYear
    1995
  • fDate
    21-24 May 1995
  • Firstpage
    499
  • Lastpage
    504
  • Abstract
    This paper describes an ongoing research effort at the High Density Electronics Center (HiDEC) and the University of Arkansas for developing optimal system designs based on Multichip Module (MCM) technology. This research effort is focused on developing a high performance superscalar processor architecture designed for use in an MIMD parallel architecture. The architectural tradeoffs performed for developing the superscalar architecture are discussed, including the partitioning of functionality in order to take advantage of the high density, high bandwidth I/O capabilities of MCMs. Results of an analysis study are also presented, showing the performance increase of the optimal MCM based design compared to a traditionally packaged RISC architecture
  • Keywords
    multichip modules; parallel architectures; pipeline processing; MCM technology; MIMD parallel architecture; high bandwidth I/O capabilities; high density; multichip module; optimal MCM based design; optimal implementation; superscalar architecture; Bandwidth; Circuit testing; Integrated circuit interconnections; Multichip modules; Packaging; Parallel architectures; Parallel machines; Performance analysis; Reduced instruction set computing; Silicon;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference, 1995. Proceedings., 45th
  • Conference_Location
    Las Vegas, NV
  • Print_ISBN
    0-7803-2736-5
  • Type

    conf

  • DOI
    10.1109/ECTC.1995.515327
  • Filename
    515327