Title :
Future military avionics applications of wafer-scale technology
Author :
Morgan, Reed ; Soraya, Marv
Author_Institution :
Wright Res. & Dev. Center, Wright-Patterson AFB, OH, USA
Abstract :
Wafer-scale integration (WSI) technology has the potential to improve avionics system reliability substantially and enable the development of airborne-compatible supercomputers for real-time machine intelligence and new forms of sensor integration. Companion technologies in the areas of advanced packaging, cooling and photonics will need to be integrated with WSI in order to achieve these goals. The potential use of flyable wafer-based supercomputers for extremely high throughput applications is described. These applications and associated processing requirements are also described
Keywords :
VLSI; aircraft instrumentation; military equipment; packaging; WSI; advanced packaging; airborne-compatible supercomputers; cooling; flyable wafer-based supercomputers; military avionics applications; photonics; real-time machine intelligence; sensor integration; system reliability; throughput applications; wafer-scale technology; Aerospace electronics; Cooling; Intelligent sensors; Machine intelligence; Packaging machines; Real time systems; Reliability; Sensor systems; Supercomputers; Wafer scale integration;
Conference_Titel :
Wafer Scale Integration, 1989. Proceedings., [1st] International Conference on
Conference_Location :
San Francisco, CA
Print_ISBN :
0-8186-9901-9
DOI :
10.1109/WAFER.1989.47530
