High performance 3D MCM using silicon microtechnologies

Future applications will require a higher I/O count, more densification, greater performance and lower cost. The Multichip Modules (MCM) offer this technical potential and possible lower cost for the global system. Three dimensional (3D) packaging is another technique that provides size and performance benefits. This paper describes a 3D structure developed in LETI with microtechnologies in and on silicon substrates. This 3D-MCM made from 2D-MCM/D technology offers a lot of advantages in terms of electrical and thermal performance. A large application field in microelectronics is ready for mass memory modules or parallel processor computers and also in microsystems where different technologies have to be closely interconnected. A technology demonstrator is presented, the chosen application is a 1-Gbit mass memory module which contains 64×16 Mbit DRAMs interconnected on 8-stacked MCMs