Performance and reliability of a three-dimensional plastic moulded vertical multichip module (MCM-V)

Author

Barrett, J. ; Cahill, C. ; Compagno, T. ; Flaherty, Martin O. ; Hayes, T. ; Lawton, W. ; Donavan, J.O. ; Mathúna, C.O. ; McCarthy, G. ; Slattery, O. ; Waldron, F. ; Vera, A. Coella ; Masgrangeas, M. ; Pipard, P. ; Val, C. ; Serthelon, I.

Author_Institution

Nat. Microelectron. Res. Centre, Univ. Coll. Cork, Ireland

fYear

1995

fDate

21-24 May 1995

Firstpage

656

Lastpage

663

Abstract

The performance and reliability of a low-cost three-dimensional plastic moulded vertical multi-chip module concept is presented. Performance was evaluated using custom designed chips incorporating thermal, thermomechanical, electrical and reliability test structures. Results of performance are presented and are shown to correlate well with thermal, thermomechanical and electrical simulations. The thermal and thermomechanical performances are sufficient to allow use of the MCM-V technique in a wide range of applications without the need for special cooling techniques. Reliability testing to space level standards was carried out on 53 technology demonstrator modules incorporating the test chips and a high level of reliability has been demonstrated

Keywords

corrosion; integrated circuit reliability; integrated circuit testing; multichip modules; plastic packaging; thermal analysis; 3D plastic moulded vertical MCM; MCM reliability; MCM-V technique; low-cost type; reliability testing; space level standards; thermal performance; thermomechanical performance; three-dimensional vertical MCM; vertical multichip module; Collaboration; Fabrication; Metallization; Microelectronics; Multichip modules; Packaging; Plastics; Space technology; Testing; Thermomechanical processes;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 1995. Proceedings., 45th

Conference_Location

Las Vegas, NV

Print_ISBN

0-7803-2736-5

Type

conf

DOI

10.1109/ECTC.1995.515352

Filename

515352