• DocumentCode
    2391567
  • Title

    Porous alumina based capacitive MEMS RH sensor

  • Author

    Juhász, László ; Váss-Vamai, András ; Timár-Horváth, Veronika ; Desmulliez, Marc P Y ; Dhariwal, Resh S.

  • Author_Institution
    Dept. of Electron Devices, Budapest Univ. of Technol. & Econ., Budapest
  • fYear
    2008
  • fDate
    9-11 April 2008
  • Firstpage
    381
  • Lastpage
    385
  • Abstract
    The aim of a joint research and development project at the BME and HWU is to produce a cheap, reliable, low-power and CMOS-MEMS process compatible capacitive type relative humidity (RH) sensor that can be incorporated into a state-of-the-art, wireless sensor network. In this paper we discuss the preparation of our new capacitive structure based on post-CMOS MEMS processes and the methods which were used to characterize the thin film porous alumina sensing layer. The average sensitivity is approx. 15 pFIRH% which is more than a magnitude higher than the values found in the literature. The sensor is equipped with integrated resistive heating, which can be used for maintenance to reduce drift, or for keeping the sensing layer at elevated temperature, as an alternative method for temperature-dependence cancellation.
  • Keywords
    CMOS integrated circuits; alumina; capacitive sensors; humidity sensors; microsensors; porous materials; thin films; Al2O3; CMOS-MEMS process; MEMS sensor; capacitive sensor; integrated resistive heating; porous alumina based sensor; relative humidity sensor; temperature-dependence cancellation; thin film; wireless sensor network; Capacitive sensors; Heating; Humidity; Micromechanical devices; Research and development; Sensor phenomena and characterization; Temperature sensors; Thermal sensors; Transistors; Wireless sensor networks;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Design, Test, Integration and Packaging of MEMS/MOEMS, 2008. MEMS/MOEMS 2008. Symposium on
  • Conference_Location
    Nice
  • Print_ISBN
    978-2-35500-006-5
  • Type

    conf

  • DOI
    10.1109/DTIP.2008.4753024
  • Filename
    4753024