DocumentCode
2391729
Title
Practical Work Function Tuning Based on Physical and Chemical Nature of Interfacial Impurity in Ni-FUSI/SiON and HfSiON Systems
Author
Tsuchiya, Yoshinori ; Yoshiki, Masahiko ; Sato, Motoyuki ; Sekine, Katsuyuki ; Saito, Tomohiro ; Nakajima, Kazuaki ; Aoyama, Tomonori ; Koga, Junji ; Nishiyama, Akira ; Koyama, Masato
Author_Institution
Corporate R & D Center, Toshiba Corp.
fYear
2006
fDate
11-13 Dec. 2006
Firstpage
1
Lastpage
4
Abstract
The paper demonstrates large effective work function (Phieff) modulation towards Si band-edges based on physical and chemical nature of interfacial impurities at Ni-FUSI/SiON and HfSiON interfaces. The authors clarify the influence of Ni-silicide phase on the Phieff modulation with dopant segregation. Phieff of 4.14 eV is obtained with a combination of phosphorous ion implantation last (IIL) doping and newly developed low temperature NiSi2 formation process. The paper also proposed the realistic Phieff modulation with Al-segregation at Ni-FUSI/HfSiON using IIL-doping process
Keywords
hafnium compounds; ion implantation; nickel compounds; semiconductor doping; silicon compounds; work function; HfSiON; Ni-SiON; chemical nature; dopant segregation; interfacial impurity; ion implantation; physical nature; work function modulation; work function tuning; Chemical engineering; Chemical processes; Chemical technology; Dielectrics; Doping; Ion implantation; Phase modulation; Semiconductor impurities; Silicides; Temperature;
fLanguage
English
Publisher
ieee
Conference_Titel
Electron Devices Meeting, 2006. IEDM '06. International
Conference_Location
San Francisco, CA
Print_ISBN
1-4244-0438-X
Electronic_ISBN
1-4244-0439-8
Type
conf
DOI
10.1109/IEDM.2006.347005
Filename
4154440
Link To Document