DocumentCode :
2392492
Title :
Floorplanning challenges in early chip planning
Author :
Shin, Jeonghee ; Darringer, John A. ; Luo, Guojie ; Aharoni, Merav ; Lvov, Alexey Y. ; Nam, Gi-Joon ; Healy, Michael B.
Author_Institution :
IBM T. J. Watson Res. Center, Yorktown Heights, NY, USA
fYear :
2011
fDate :
26-28 Sept. 2011
Firstpage :
388
Lastpage :
393
Abstract :
Early chip planning is becoming more critical as server system designers strive to explore a large design space with multiple cores and accelerators in an advanced silicon technology that includes 3D chip stacking. During early chip planning, designers search for the high-level design and layout that best satisfies a myriad of constraints and targets. In this paper, we discuss our experience in applying traditional floorplanning tools at this early stage and suggest how they might be adapted for early floorplanning.
Keywords :
integrated circuit layout; integration; three-dimensional integrated circuits; 3D chip stacking; accelerators; advanced silicon technology; early chip planning; floorplanning challenges; high level design; high level layout; multiple cores; server system designers; Industries; Multi-stage noise shaping; Scalability;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
SOC Conference (SOCC), 2011 IEEE International
Conference_Location :
Taipei
ISSN :
2164-1676
Print_ISBN :
978-1-4577-1616-4
Electronic_ISBN :
2164-1676
Type :
conf
DOI :
10.1109/SOCC.2011.6085096
Filename :
6085096
Link To Document :
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