DocumentCode :
2393080
Title :
TSV sharing through multiplexing for TSV count minimization in high-level synthesis
Author :
Tu, Wen-Pin ; Lee, Yen-Hsin ; Huang, Shih-Hsu
Author_Institution :
Dept. of Electron. Eng., Chung Yuan Christian Univ., Chungli, Taiwan
fYear :
2011
fDate :
26-28 Sept. 2011
Firstpage :
156
Lastpage :
159
Abstract :
TSV count minimization is an important topic for 3D ICs. In previous works, TSV sharing is limited to the same functional unit output and the same functional unit input. In this paper, we present the first attempt to use multiplexers to extend TSV sharing for cross-layer data transfers that have different functional unit outputs and different functional unit inputs. We use an ILP (integer linear programming) to formally draw up the simultaneous application of resource binding, layer assignment, and TSV sharing (through multiplexing) to minimize the TSV count. Compared with previous works, our approach can greatly further reduce the TSV count.
Keywords :
high level synthesis; integer programming; linear programming; minimisation; multiplexing equipment; three-dimensional integrated circuits; 3D IC; ILP; TSV count minimization; TSV sharing; cross-layer data transfers; functional unit input; functional unit output; high-level synthesis; integer linear programming; three dimensional integrated circuit; through-silicon-via minimization; through-silicon-via sharing; Adders; Benchmark testing; Integrated circuit interconnections; Minimization; Multiplexing; Three dimensional displays; Through-silicon vias;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
SOC Conference (SOCC), 2011 IEEE International
Conference_Location :
Taipei
ISSN :
2164-1676
Print_ISBN :
978-1-4577-1616-4
Electronic_ISBN :
2164-1676
Type :
conf
DOI :
10.1109/SOCC.2011.6085124
Filename :
6085124
Link To Document :
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