• DocumentCode
    2393421
  • Title

    Positive electret substrates enhance neuroblastoma process outgrowth

  • Author

    Makohliso, S.A. ; Valentini, R.F. ; West, J.E. ; Aebischer, P.

  • Author_Institution
    Section of Artificial Organs, Biomater, & Cellular Technol., Brown Univ., Providence, RI, USA
  • fYear
    1991
  • fDate
    25-27 Sep 1991
  • Firstpage
    712
  • Lastpage
    716
  • Abstract
    FEP (fluorinated ethylene propylene) electret substrates provide a means of investigating the biological response of neuronal cells contacting a charged surface. Mouse neuroblastoma cells were placed on positive, negative, and uncharged FEP substrates, and were assessed for process outgrowth. Significantly more cells sent out neurite processes on positive substrates as compared to negative and uncharged substrates. Electron spectroscopy for chemical analysis, contact angle analysis, and scanning electron microscopy revealed no surface chemical or morphological distinction between charged and uncharged substrates. This study demonstrates that a positively charged surface induces greater neuronal outgrowth than a negatively charged or uncharged surface
  • Keywords
    bioelectric phenomena; cellular biophysics; contact angle; electrets; neurophysiology; polymers; scanning electron microscope examination of materials; ESCA; biological response; charged surface; contact angle analysis; fluorinated ethylene propylene; mouse neuroblastoma cells; negative substrate; neurite processes; neuroblastoma process outgrowth; neuronal cells; positive electret substrates; positive substrates; scanning electron microscopy; uncharged FEP substrates; Bioelectric phenomena; Cells (biology); Chemical analysis; Electrets; Embryo; Mice; Neurons; Surface charging; Surface morphology; Testing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrets, 1991. (ISE 7) Proceedings., 7th International Symposium on (Cat. No.91CH3029-6)
  • Conference_Location
    Berlin
  • Print_ISBN
    0-7803-0112-9
  • Type

    conf

  • DOI
    10.1109/ISE.1991.167299
  • Filename
    167299