Title :
The development of a tool to predict package level thermal interface material performance
Author :
Solbrekken, Gary L. ; Chiu, Chia-Pin ; Byers, Ben ; Reichebbacher, D.
Author_Institution :
Intel Corp., Chandler, AZ, USA
Abstract :
The characterization of thermal interface materials in electronic applications is necessary to ensure timely product launches. A tester has been developed at Intel to screen grease, phase change, and elastomer type materials, without having to go through the time and expense of completing package level measurements. The tester was designed to test materials at controlled bond line thickness and controlled pressures, while being able to directly measure the bond line thickness. The tester is capable of evaluating an interface material thermal impedance with a reproducibility of 0.03°C*cm2/W at a 95% confidence level. The tester can also be used to evaluate the bulk thermal conductivity and thermal contact impedance of a material. A package level study was completed to illustrate how tester characterization data can be used to effectively rank order interface materials
Keywords :
elastomers; integrated circuit packaging; integrated circuit testing; thermal conductivity; thermal resistance; Intel; bulk thermal conductivity; controlled bond line thickness; elastomer type materials; grease; interface material thermal impedance; order interface materials; package level; phase change materials; reproducibility; tester characterization data; thermal contact impedance; thermal interface material performance; Bonding; Conducting materials; Electronic packaging thermal management; Impedance; Level measurement; Materials testing; Phase change materials; Pressure control; Thermal conductivity; Thickness control;
Conference_Titel :
Thermal and Thermomechanical Phenomena in Electronic Systems, 2000. ITHERM 2000. The Seventh Intersociety Conference on
Conference_Location :
Las Vegas, NV
Print_ISBN :
0-7803-5912-7
DOI :
10.1109/ITHERM.2000.866807
