DocumentCode
2393584
Title
“Manufacturing test of systems-on-a-chip (SoCs)”
Author
Abraham, Jacob A.
Author_Institution
Comput. Eng. Res. Center, Univ. of Texas at Austin, Austin, TX, USA
fYear
2011
fDate
26-28 Sept. 2011
Firstpage
272
Lastpage
272
Abstract
Summary form only given. Testing chips after manufacture, unlike producing transistors on a chip, does not enjoy the scaling offered by Moore´s law. This tutorial will outline the increasing difficulties with manufacturing test and discuss approaches to manage the complexity of testing SoCs, including generation and design-for-test techniques for classic “stuck-at” faults as well as small delay defects which are becoming more common in scaled technologies. Issues with testing embedded analog, mixed-signal and RF modules will be addressed. Test approaches which use the computational resources within a (SoC) to test itself will also be discussed. The embedded processor in the SoC can test itself by running instruction sequences from memory. The processor can be used to test other cores in the SoC, including mixed-signal cores for analog and RF specifications, with the help of design-for-test structures such as on-chip sensors.
Keywords
design for testability; fault diagnosis; integrated circuit testing; mixed analogue-digital integrated circuits; radiofrequency integrated circuits; system-on-chip; RF module; SoC; design for test technique; embedded analog module; manufacturing test; mixed-signal cores; mixed-signal module; on-chip sensor; running instruction sequences; stuck-at faults; systems-on-chip; testing complexity;
fLanguage
English
Publisher
ieee
Conference_Titel
SOC Conference (SOCC), 2011 IEEE International
Conference_Location
Taipei
ISSN
2164-1676
Print_ISBN
978-1-4577-1616-4
Electronic_ISBN
2164-1676
Type
conf
DOI
10.1109/SOCC.2011.6085148
Filename
6085148
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