• DocumentCode
    2393584
  • Title

    “Manufacturing test of systems-on-a-chip (SoCs)”

  • Author

    Abraham, Jacob A.

  • Author_Institution
    Comput. Eng. Res. Center, Univ. of Texas at Austin, Austin, TX, USA
  • fYear
    2011
  • fDate
    26-28 Sept. 2011
  • Firstpage
    272
  • Lastpage
    272
  • Abstract
    Summary form only given. Testing chips after manufacture, unlike producing transistors on a chip, does not enjoy the scaling offered by Moore´s law. This tutorial will outline the increasing difficulties with manufacturing test and discuss approaches to manage the complexity of testing SoCs, including generation and design-for-test techniques for classic “stuck-at” faults as well as small delay defects which are becoming more common in scaled technologies. Issues with testing embedded analog, mixed-signal and RF modules will be addressed. Test approaches which use the computational resources within a (SoC) to test itself will also be discussed. The embedded processor in the SoC can test itself by running instruction sequences from memory. The processor can be used to test other cores in the SoC, including mixed-signal cores for analog and RF specifications, with the help of design-for-test structures such as on-chip sensors.
  • Keywords
    design for testability; fault diagnosis; integrated circuit testing; mixed analogue-digital integrated circuits; radiofrequency integrated circuits; system-on-chip; RF module; SoC; design for test technique; embedded analog module; manufacturing test; mixed-signal cores; mixed-signal module; on-chip sensor; running instruction sequences; stuck-at faults; systems-on-chip; testing complexity;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    SOC Conference (SOCC), 2011 IEEE International
  • Conference_Location
    Taipei
  • ISSN
    2164-1676
  • Print_ISBN
    978-1-4577-1616-4
  • Electronic_ISBN
    2164-1676
  • Type

    conf

  • DOI
    10.1109/SOCC.2011.6085148
  • Filename
    6085148