Packaging of a MEMS based safety and arming device

Author

Deeds, Michael ; Sandborn, Peter ; Swaminathan, Rajesh

Author_Institution

Indian Head Naval Surface Warfare Center, India

Volume

1

fYear

2000

fDate

2000

Lastpage

112

Abstract

Packaging of MEMS devices introduces new challenges to the package architecture. MEMS systems introduce new interfaces, processes, and materials foreign to the IC packaging industry. To build reliable MEMS systems, failure modes must be activated and understood. In addition, the metrology techniques must be developed to interrogate critical aspects of the package. The system presented in this paper is a MEMS based safety and arming device (S&A) for underwater weapons. Critical components, packaged in various hermetic and non-hermetic configurations, are cycled through a series of metrologies and environmental conditioning

Keywords

marine systems; micromechanical devices; packaging; safety systems; weapons; MEMS safety and arming device; environmental conditioning; failure mode; hermetic configuration; metrology; nonhermetic configuration; packaging; underwater weapon; Explosives; Humidity; Integrated circuit packaging; Microelectromechanical devices; Micromechanical devices; Optical devices; Optical sensors; Safety devices; Testing; Weapons;

fLanguage

English

Publisher

ieee

Conference_Titel

Thermal and Thermomechanical Phenomena in Electronic Systems, 2000. ITHERM 2000. The Seventh Intersociety Conference on

Conference_Location

Las Vegas, NV

ISSN

1089-9870

Print_ISBN

0-7803-5912-7

Type

conf

DOI

10.1109/ITHERM.2000.866815

Filename

866815