Title :
Wafer-level packaging technology for MEMS
Author_Institution :
Electron. Visions Inc., Phoenix, AZ, USA
Abstract :
This paper reviews the essential MEMS (Microelectromechanical Systems) silicon wafer processes that are needed for wafer-level packaging. Precision aligned wafer bonding is the key enabling technology for high-volume, low cost packaging of MEMS devices. State-of-the-art aligned silicon wafer bonding can provide not only basic MEMS device functionality, but also first-level assembly or packaging solutions for many MEMS devices. Numerous examples of high-volume production applications for wafer-level bonding will be described
Keywords :
micromechanical devices; packaging; wafer bonding; MEMS device; Si; microelectromechanical system; silicon wafer bonding; volume production; wafer level packaging technology; Assembly; Costs; Microelectromechanical devices; Microelectromechanical systems; Micromechanical devices; Packaging; Production; Silicon; Wafer bonding; Wafer scale integration;
Conference_Titel :
Thermal and Thermomechanical Phenomena in Electronic Systems, 2000. ITHERM 2000. The Seventh Intersociety Conference on
Conference_Location :
Las Vegas, NV
Print_ISBN :
0-7803-5912-7
DOI :
10.1109/ITHERM.2000.866816
