DocumentCode
2394625
Title
Evaluation on ESD robustness of LTPS diode and TFT device by transmission line pulsing (TLP) technique
Author
Ker, Ming-Dou ; Tseng, Tang-Kui ; Yang, Sheng-Chieh ; Shih, An ; Tsai, Yaw-Ming
Author_Institution
Inst. of Electron., Nat. Chiao-Tung Univ., Hsinchu, Taiwan
fYear
2003
fDate
6-8 Oct. 2003
Firstpage
88
Lastpage
91
Abstract
ESD robustness of Low Temperature Poly-Si (LTPS) diodes and TFT devices has been investigated in this paper. By using the Transmission Line Pulsing (TLP) techniques, the It2 (secondary breakdown current) of LTPS diodes and TFT devices were measured. To evaluate the ESD robustness of components for ESD protection, the shifts of breakdown voltage and cut-in voltage of LTPS diode and TFT devices after TLP stress are considered into failure threshold judgment. From the experimental results, It2 of LTPS diodes under forward-biased stress is better than that of LTPS TFT devices. Furthermore, the It2 of LTPS TFT devices under reverse-biased stress is more robust than it under forward-biased stress. Such investigation results can help us to design a successful ESD protection for the circuits on glass.
Keywords
electrostatic discharge; elemental semiconductors; failure analysis; reliability; robust control; semiconductor device breakdown; semiconductor diodes; silicon; thin film transistors; ESD robustness; Si; TFT device; breakdown voltage; failure threshold judgment; forward-biased stress; low temperature poly-Si diodes; reverse-biased stress; secondary breakdown current; transmission line pulsing; Current measurement; Diodes; Electric breakdown; Electrostatic discharge; Protection; Robustness; Stress; Temperature; Thin film transistors; Transmission lines;
fLanguage
English
Publisher
ieee
Conference_Titel
VLSI Technology, Systems, and Applications, 2003 International Symposium on
ISSN
1524-766X
Print_ISBN
0-7803-7765-6
Type
conf
DOI
10.1109/VTSA.2003.1252559
Filename
1252559
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