DocumentCode
2394769
Title
Future silicon technology trends from a system application perspective
Author
Ning, Tak H.
Author_Institution
IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
fYear
2003
fDate
6-8 Oct. 2003
Firstpage
121
Lastpage
124
Abstract
Digital CMOS is fast reaching its scaling limits. Nonetheless, CMOS will remain the backbone technology for building all computing functions. While attempts to extend the limits of CMOS will continue, there will also be increasing focus on other silicon technologies that are needed by system designers. For computing systems, large amounts of high-performance on-chip memory are needed to minimize memory-bottleneck penalty. For systems where magnetic disks are not available, large amounts of NVRAM are needed for data storage. High-performance and low-power mixed-signal technology is needed for systems requiring wireless communication. Recent as well as expected advances in these developments are discussed.
Keywords
CMOS memory circuits; DRAM chips; SRAM chips; elemental semiconductors; mixed analogue-digital integrated circuits; silicon; NVRAM; Si; computing functions; data storage; digital CMOS; magnetic disks; memory bottleneck penalty; mixed-signal technology; on-chip memory; silicon technology; system designers; wireless communication; CMOS digital integrated circuits; CMOS logic circuits; CMOS technology; Nonvolatile memory; Personal digital assistants; Power system reliability; Radio frequency; Random access memory; Silicon; System performance;
fLanguage
English
Publisher
ieee
Conference_Titel
VLSI Technology, Systems, and Applications, 2003 International Symposium on
ISSN
1524-766X
Print_ISBN
0-7803-7765-6
Type
conf
DOI
10.1109/VTSA.2003.1252567
Filename
1252567
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