• DocumentCode
    2395115
  • Title

    An Advanced Model for Dopant Diffusion in Polycrystalline silicon during rapid thermal annealing

  • Author

    Abadli, S. ; Mansour, F.

  • Author_Institution
    Dept. of Electron., Mentouri Route d´´Ain EL-Bey Univ., Constantine
  • fYear
    2006
  • fDate
    Dec. 2006
  • Firstpage
    11
  • Lastpage
    14
  • Abstract
    We have investigated and modelled the diffusion of boron implanted into polycrystalline silicon. A one-dimensional two stream diffusion model adapted to the granular structure of polysilicon and to the effects of the strong-concentrations has been developed. This model includes dopant clustering in grains as well as in grain boundaries. The grains-growth and energy barrier height are coupled with the dopant diffusion coefficients and the process temperature based on thermodynamic concepts. The simulation well reproduces the experimental profiles when crystallisation and clustering are considered. The trapping-emission mechanism between grains and grain boundaries and segregation are the major effects during annealing process
  • Keywords
    boron; crystallisation; elemental semiconductors; grain boundaries; rapid thermal annealing; semiconductor process modelling; semiconductor thin films; silicon; B; Si; crystallisation; diffusion model; dopant clustering; dopant diffusion; grain boundaries; grains-growth; polycrystalline silicon; polysilicon granular structure; rapid thermal annealing; Boron; Doping profiles; Grain boundaries; Ion implantation; Micromechanical devices; Rapid thermal annealing; Semiconductor process modeling; Silicon; Solids; Temperature;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    MEMS, NANO and Smart Systems, The 2006 International Conference on
  • Conference_Location
    Cairo
  • Print_ISBN
    1-4244-0899-7
  • Type

    conf

  • DOI
    10.1109/ICMENS.2006.348206
  • Filename
    4155223