• DocumentCode
    2396573
  • Title

    Micro package of short term wireless implantable microfabricated systems

  • Author

    Bu, Leping ; Cong, Peng ; Kuo, Hung-I ; Ye, Xuesong ; Ko, Wen

  • Author_Institution
    Case Western Reserve Univ., Cleveland, OH, USA
  • fYear
    2009
  • fDate
    3-6 Sept. 2009
  • Firstpage
    6395
  • Lastpage
    6399
  • Abstract
    Package is a critical part in biomedical implantable systems. Many factors affecting the host body and the life time of implantable systems need to be considered. Package becomes more critical for microfabricated systems with wireless charging and communication. This paper presents the first phase study on micro package techniques for short term (30 to 90 days) implantable systems. A MEMS implantable telemetry model system was designed for packaging evaluation. The transmitter was custom designed and fabricated using MOSIS processes and an external receiver was designed and built for data collection. For short term implantable systems, medical grade silicone outer coating is used for ldquotissue compatibilityrdquo; while multilayer polymeric and nanometer-thin metal or ceramic films were used for inner coatings to provide mechanical strength and to block vapor and moisture penetration. The total coating thickness is less than 0.6 mm. The electrical performances (leakage resistance) of test board and model devices coated with various package materials and processes are evaluated in 40degC saline. This paper presents: the model system; the evaluation methods and analysis of failure modes of polymeric coating on test boards; the solution to the failures and suggested coating techniques of polymeric materials; and the evaluation of model systems packaged with multi-layer coatings in 40degC saline. The expected performance of developed packaging method was verified by experiments. Implantable wireless MEMS system can be packaged with thin multilayer materials to have an expected life time greater than 30 days.
  • Keywords
    bioMEMS; ceramics; microfabrication; packaging; polymer films; prosthetics; MEMS implants; MOSIS process; biomedical implantable systems; ceramic films; lifetime; mechanical strength; metal films; micropackage; moisture penetration blocking; multilayer polymeric films; vapor penetration blocking; wireless charging; wireless communication; wireless implantable microfabricated systems; Equipment Design; Equipment Failure Analysis; Micro-Electrical-Mechanical Systems; Miniaturization; Prostheses and Implants; Reproducibility of Results; Sensitivity and Specificity; Signal Processing, Computer-Assisted; Telemetry;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Engineering in Medicine and Biology Society, 2009. EMBC 2009. Annual International Conference of the IEEE
  • Conference_Location
    Minneapolis, MN
  • ISSN
    1557-170X
  • Print_ISBN
    978-1-4244-3296-7
  • Electronic_ISBN
    1557-170X
  • Type

    conf

  • DOI
    10.1109/IEMBS.2009.5333726
  • Filename
    5333726