DocumentCode
2396573
Title
Micro package of short term wireless implantable microfabricated systems
Author
Bu, Leping ; Cong, Peng ; Kuo, Hung-I ; Ye, Xuesong ; Ko, Wen
Author_Institution
Case Western Reserve Univ., Cleveland, OH, USA
fYear
2009
fDate
3-6 Sept. 2009
Firstpage
6395
Lastpage
6399
Abstract
Package is a critical part in biomedical implantable systems. Many factors affecting the host body and the life time of implantable systems need to be considered. Package becomes more critical for microfabricated systems with wireless charging and communication. This paper presents the first phase study on micro package techniques for short term (30 to 90 days) implantable systems. A MEMS implantable telemetry model system was designed for packaging evaluation. The transmitter was custom designed and fabricated using MOSIS processes and an external receiver was designed and built for data collection. For short term implantable systems, medical grade silicone outer coating is used for ldquotissue compatibilityrdquo; while multilayer polymeric and nanometer-thin metal or ceramic films were used for inner coatings to provide mechanical strength and to block vapor and moisture penetration. The total coating thickness is less than 0.6 mm. The electrical performances (leakage resistance) of test board and model devices coated with various package materials and processes are evaluated in 40degC saline. This paper presents: the model system; the evaluation methods and analysis of failure modes of polymeric coating on test boards; the solution to the failures and suggested coating techniques of polymeric materials; and the evaluation of model systems packaged with multi-layer coatings in 40degC saline. The expected performance of developed packaging method was verified by experiments. Implantable wireless MEMS system can be packaged with thin multilayer materials to have an expected life time greater than 30 days.
Keywords
bioMEMS; ceramics; microfabrication; packaging; polymer films; prosthetics; MEMS implants; MOSIS process; biomedical implantable systems; ceramic films; lifetime; mechanical strength; metal films; micropackage; moisture penetration blocking; multilayer polymeric films; vapor penetration blocking; wireless charging; wireless communication; wireless implantable microfabricated systems; Equipment Design; Equipment Failure Analysis; Micro-Electrical-Mechanical Systems; Miniaturization; Prostheses and Implants; Reproducibility of Results; Sensitivity and Specificity; Signal Processing, Computer-Assisted; Telemetry;
fLanguage
English
Publisher
ieee
Conference_Titel
Engineering in Medicine and Biology Society, 2009. EMBC 2009. Annual International Conference of the IEEE
Conference_Location
Minneapolis, MN
ISSN
1557-170X
Print_ISBN
978-1-4244-3296-7
Electronic_ISBN
1557-170X
Type
conf
DOI
10.1109/IEMBS.2009.5333726
Filename
5333726
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