• DocumentCode
    2396931
  • Title

    Study on prediction models for integrated scheduling in semiconductor manufacturing lines

  • Author

    Guo, Lu ; Hao, Jing-hua ; Liu, Min

  • Author_Institution
    Dept. of Autom., Tsinghua Univ., Beijing, China
  • fYear
    2012
  • fDate
    19-20 May 2012
  • Firstpage
    2320
  • Lastpage
    2324
  • Abstract
    Prediction of machine breakdowns and lot product qualities plays an important role in scheduling of semiconductor manufacturing lines because accurate state of machines and lot are a key prerequisite for good scheduling. The difficulties in modeling result from the datum with high dimensions and stochastic noise that are brought inevitably in actual environment. This paper presents a novel prediction model referred as Incremental Extreme Least Square Support Vector Machine (IELSSVM), which transforms the data into Extreme Learning Machine (ELM) space and then minimize the structural risk like LSSVM. The transformation into ELM feature space can be regarded as a good dimensionality reduction. The incremental formula is proposed for on-line industrial application to avoid retraining when data comes one by one or chunk by chunk.
  • Keywords
    industrial plants; learning (artificial intelligence); least squares approximations; product quality; scheduling; semiconductor device manufacture; support vector machines; ELM; IELSSVM; dimensional reduction; extreme learning machine; incremental extreme least square support vector machine; integrated scheduling; lot product qualities; machine breakdown prediction; prediction models; semiconductor manufacturing lines; stochastic noise; Classification algorithms; Integrated circuits; Job shop scheduling; Manufacturing; Semiconductor device measurement; Support vector machines; Training data; IELSSVM; high dimension; integration; quality prediction model; scheduling; semiconductor manufacturing lines;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Systems and Informatics (ICSAI), 2012 International Conference on
  • Conference_Location
    Yantai
  • Print_ISBN
    978-1-4673-0198-5
  • Type

    conf

  • DOI
    10.1109/ICSAI.2012.6223519
  • Filename
    6223519