DocumentCode :
2397505
Title :
High-speed interconnections using true single-phase clocking
Author :
Audet, D. ; Savaria, Y.
Author_Institution :
Quebec Univ., Chicoutimi, Que., Canada
fYear :
1995
fDate :
18-20 Jan 1995
Firstpage :
258
Lastpage :
266
Abstract :
Long interconnections in wafer scale systems can severely limit their operating frequency and the speed of data transfers between distant components. One way to significantly improve these parameters consists in converting long wires into synchronous pipelines. For this purpose, a high-speed pipeline stage has been designed using a state-of-the-art circuit design methodology: single-phase clocking. This methodology usually allows one to design faster circuitries with lower transistor counts. Based on SPICE simulations, it is shown that the designed pipeline stage can transfer data at rates above 800 Mbits/s per wire, when a 1.2 μm CMOS technology is used. In order to estimate the maximum data rate when such pipeline stages are used in a practical situation, SPICE simulations were also carried out by interconnecting them using 1 cm metallic wire segments. It is shown that, in this case, data transfer rates larger than 300 Mbits/s can be reached
Keywords :
CMOS digital integrated circuits; integrated circuit design; integrated circuit interconnections; pipeline processing; timing; wafer-scale integration; 1.2 micron; 300 Mbit/s; 800 Mbit/s; CMOS technology; SPICE simulations; circuit design methodology; data transfer rates; high-speed interconnections; high-speed pipeline stage; single-phase clocking; synchronous pipelines; wafer scale systems; CMOS technology; Circuit simulation; Clocks; Frequency; Integrated circuit interconnections; Latches; Pipelines; SPICE; Silicon; Wire;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Wafer Scale Integration, 1995. Proceedings., Seventh Annual IEEE International Conference on
Conference_Location :
San Francisco, CA
Print_ISBN :
0-7803-2467-6
Type :
conf
DOI :
10.1109/ICWSI.1995.515460
Filename :
515460
Link To Document :
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