• DocumentCode
    2397505
  • Title

    High-speed interconnections using true single-phase clocking

  • Author

    Audet, D. ; Savaria, Y.

  • Author_Institution
    Quebec Univ., Chicoutimi, Que., Canada
  • fYear
    1995
  • fDate
    18-20 Jan 1995
  • Firstpage
    258
  • Lastpage
    266
  • Abstract
    Long interconnections in wafer scale systems can severely limit their operating frequency and the speed of data transfers between distant components. One way to significantly improve these parameters consists in converting long wires into synchronous pipelines. For this purpose, a high-speed pipeline stage has been designed using a state-of-the-art circuit design methodology: single-phase clocking. This methodology usually allows one to design faster circuitries with lower transistor counts. Based on SPICE simulations, it is shown that the designed pipeline stage can transfer data at rates above 800 Mbits/s per wire, when a 1.2 μm CMOS technology is used. In order to estimate the maximum data rate when such pipeline stages are used in a practical situation, SPICE simulations were also carried out by interconnecting them using 1 cm metallic wire segments. It is shown that, in this case, data transfer rates larger than 300 Mbits/s can be reached
  • Keywords
    CMOS digital integrated circuits; integrated circuit design; integrated circuit interconnections; pipeline processing; timing; wafer-scale integration; 1.2 micron; 300 Mbit/s; 800 Mbit/s; CMOS technology; SPICE simulations; circuit design methodology; data transfer rates; high-speed interconnections; high-speed pipeline stage; single-phase clocking; synchronous pipelines; wafer scale systems; CMOS technology; Circuit simulation; Clocks; Frequency; Integrated circuit interconnections; Latches; Pipelines; SPICE; Silicon; Wire;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Wafer Scale Integration, 1995. Proceedings., Seventh Annual IEEE International Conference on
  • Conference_Location
    San Francisco, CA
  • Print_ISBN
    0-7803-2467-6
  • Type

    conf

  • DOI
    10.1109/ICWSI.1995.515460
  • Filename
    515460