DocumentCode :
2397622
Title :
The impact of floorplanning on the yield of fault-tolerant ICs
Author :
Koren, Zahava ; Koren, Israel
Author_Institution :
Dept. of Ind. Eng. & Oper. Res., Massachusetts Univ., Amherst, MA, USA
fYear :
1995
fDate :
18-20 Jan 1995
Firstpage :
329
Lastpage :
338
Abstract :
Until now, VLSI designers rarely considered yield issues when selecting a floorplan for a newly designed chip. This paper demonstrates that for large area VLSI chips, especially those that incorporate some fault tolerance, changes in the floorplan can affect the projected yield. We study several general floorplan structures, make some specific recommendations, and apply them to actual VLSI chips
Keywords :
VLSI; integrated circuit layout; integrated circuit modelling; integrated circuit reliability; integrated circuit yield; VLSI design; fault-tolerant ICs; floorplanning; large area VLSI chips; yield model; Circuit faults; Computer industry; Design engineering; Fault tolerance; Niobium; Operations research; Performance evaluation; Redundancy; System testing; Very large scale integration;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Wafer Scale Integration, 1995. Proceedings., Seventh Annual IEEE International Conference on
Conference_Location :
San Francisco, CA
Print_ISBN :
0-7803-2467-6
Type :
conf
DOI :
10.1109/ICWSI.1995.515467
Filename :
515467
Link To Document :
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