Diagnostic system for IC manufacturing

Author

Kibarian, John K. ; Strojwas, Andrzej J.

Author_Institution

Dept. of Electr. & Comput. Eng., Carnegie Mellon Univ., Pittsburgh, PA, USA

fYear

1991

fDate

21-23 Oct 1991

Firstpage

98

Lastpage

103

Abstract

A diagnostic system for intrawafer variability analysis which is part of the CMU (Carnegie Mellon University) diagnostic system is described. The system presented can be used to analyze parametric data for the purposes of understanding the causes of yield loss. Data from an industrial fabrication line were analyzed to show the validity of the approach. Key features of this approach are a brief learning phase and the ability to use both spatial information and electrical characteristics in the analysis. The intrawafer variability analysis system can interpret the data by comparing the features with either historical data, test structure measurements, or simulated sensitivity information. This is possible because of the flexibility built into the feature selection method

Keywords

integrated circuit manufacture; integrated circuit testing; production testing; IC manufacturing; diagnostic system; electrical characteristics; feature selection method; industrial fabrication line; intrawafer variability analysis; parametric data; sensitivity information; spatial information; test structure measurements; yield loss; Computer aided manufacturing; Computer integrated manufacturing; Costs; Fabrication; Integrated circuit manufacture; Manufacturing industries; Manufacturing processes; Performance evaluation; Process design; Textile industry;

fLanguage

English

Publisher

ieee

Conference_Titel

Advanced Semiconductor Manufacturing Conference and Workshop, 1991. ASMC 91 Proceedings. IEEE/SEMI 1991

Conference_Location

Boston, MA

Print_ISBN

0-7803-0152-8

Type

conf

DOI

10.1109/ASMC.1991.167392

Filename

167392