Title :
RVLSI applications and physical design
Author :
Anderson, Allan H. ; Berger, Robert ; Konkle, Kenneth H. ; Rhodes, F. Matthew
Author_Institution :
MIT Lincoln Lab., Lexington, MA, USA
Abstract :
Improvements in circuits density and yield have permitted restructurable VLSI wafer-scale circuits to be designed with three million transistors. The integrated power supply decoupling capacitors and denser wafer-scale interconnect used in these designs are described. Improved testing methods are required for larger designs
Keywords :
VLSI; integrated circuit testing; laser beam machining; redundancy; circuits density; integrated power supply decoupling capacitors; physical design; restructurable VLSI; testing methods; wafer-scale circuits; wafer-scale interconnect; yield; Clocks; Foundries; Integrated circuit interconnections; Integrated circuit yield; Laboratories; Power capacitors; Power supplies; Power system interconnection; Radar tracking; Registers;
Conference_Titel :
Wafer Scale Integration, 1989. Proceedings., [1st] International Conference on
Conference_Location :
San Francisco, CA
Print_ISBN :
0-8186-9901-9
DOI :
10.1109/WAFER.1989.47534
