Epoxy cure monitoring using ultrasonic spread spectrum binary signals

Author

Liaukonis, Dobilas ; Aleksandrovas, Arturas ; Svilainis, Linas

Author_Institution

Dept. of Electron. Eng., Kaunas Univ. of Technol., Kaunas, Lithuania

fYear

2014

fDate

28-29 Nov. 2014

Firstpage

1

Lastpage

4

Abstract

Procedure for dual component epoxy cure monitoring is presented. Accurate time of flight estimation was used employing the correlation processing. Several spread spectrum signals have been put in comparison with conventional pulse and toneburst signals. Experimental results presented indicate that reliable separation of curing phases can be established using both ultrasound velocity and attenuation measurements. Lowest velocity variation was produced by 4 MHz toneburst signal.

Keywords

condition monitoring; correlation methods; curing; plastics; ultrasonic materials testing; attenuation measurements; correlation processing; curing; epoxy cure monitoring; time of flight estimation; ultrasonic spread spectrum binary signals; Acoustics; Attenuation; Curing; Estimation; Monitoring; Ultrasonic imaging; Ultrasonic variables measurement; curing process minitoring; spread spectrum signals; time of flight estimatiion; ultrasonic measurements;

fLanguage

English

Publisher

ieee

Conference_Titel

Information, Electronic and Electrical Engineering (AIEEE), 2014 IEEE 2nd Workshop on Advances in

Conference_Location

Vilnius

Type

conf

DOI

10.1109/AIEEE.2014.7020332

Filename

7020332