Title :
An embedded PDMS nanocomposite strain sensor toward biomedical applications
Author :
Liu, Chao-Xuan ; Choi, Jin-Woo
Author_Institution :
Dept. of Electr. & Comput. Eng., Louisiana State Univ., Baton Rouge, LA, USA
Abstract :
This paper presents a nanocomposite strain gauge composed of poly(dimethylsiloxane) and multi-walled carbon nanotubes. Possessing excellent mechanical and piezoresistive properties, the biocompatible nanocomposites could withstand large strains repeatedly, which is desirable for miniaturized implantable biomedical devices. Prototype strain sensor was fabricated with simplicity and efficiency via microcontact printing and cast molding. Experimental results revealed sensitive response of resistance with regard to change of tensile strains. Multiple cycles of stretching and relaxing of device revealed consistent and repeatable measurements. An interesting hysteresis phenomenon was also observed. With further investigation of the elastomeric mechanisms, this strain sensing technology could yield promising potentials in many biomedical applications.
Keywords :
bioMEMS; biomedical materials; carbon nanotubes; casting; moulding; nanocomposites; piezoelectric devices; piezoresistance; polymers; printing; prosthetics; strain sensors; C; biocompatible nanocomposites; biomedical applications; cast molding; elastomeric mechanisms; embedded PDMS nanocomposite strain sensor; hysteresis phenomenon; mechanical properties; microcontact printing; miniaturized implantable biomedical devices; multiwalled carbon nanotubes; piezoresistive properties; polydimethylsiloxane; strain sensing technology; stretching-relaxing cycles; tensile strain change; Biosensing Techniques; Dimethylpolysiloxanes; Elastic Modulus; Electric Impedance; Equipment Design; Equipment Failure Analysis; Materials Testing; Micro-Electrical-Mechanical Systems; Nanotechnology; Nanotubes, Carbon; Reproducibility of Results; Sensitivity and Specificity; Stress, Mechanical; Transducers;
Conference_Titel :
Engineering in Medicine and Biology Society, 2009. EMBC 2009. Annual International Conference of the IEEE
Conference_Location :
Minneapolis, MN
Print_ISBN :
978-1-4244-3296-7
Electronic_ISBN :
1557-170X
DOI :
10.1109/IEMBS.2009.5333873