Soft defect localization (SDL) in integrated circuits using laser scanning microscopy

Soft defects in integrated circuits (ICs) are defined as failures when the IC is partially functional, but will not operate properly under all specified conditions - these conditions may be within or outside normal limits. To address soft defects, a laser scanning methodology termed soft defect localization (SDL) was developed that rapidly locates soft defects in integrated circuits. The SDL method evaluates the pass/fail state of a device in response to localized laser heating to successfully localize soft defects. The method operates globally by scanning the laser over the entire die to quickly isolate soft defects in a matter of minutes. The SDL imaging system and methodology will be described followed by the presentation of several examples.