DocumentCode :
2400403
Title :
Optimizing a 32nm development fab´s HOL defect pareto using iDO and eADC
Author :
Boye, C.A. ; Yathapu, N. ; Kini, S.
Author_Institution :
IBM Corp., Albany, NY, USA
fYear :
2009
fDate :
10-12 May 2009
Firstpage :
38
Lastpage :
40
Abstract :
This paper presents a methodology for optimizing a fab defect pareto for 32 nm Health of Line (HOL). HOL involves running a selected product as a means of generating defect baseline paretos and electrical test for key process sectors. Optimizing HOL pareto consists of increasing the capture of key yield limiting defects and minimizing the capture of non yield limiting defects. This was achieved by implementing smart binning (iDO) on the BF inspection system in conjunction with auto defect classification (eADC) on the SEM review tool.
Keywords :
Pareto optimisation; inspection; scanning electron microscopy; BF inspection system; SEM; autodefect classification; defect baseline paretos; electrical test; fab HOL defect pareto; health-of-line; implementing smart binning; key process sectors; key yield limiting defects; size 32 nm; Apertures; Classification tree analysis; Inspection; Manufacturing; Pareto optimization; Sampling methods; Testing;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Advanced Semiconductor Manufacturing Conference, 2009. ASMC '09. IEEE/SEMI
Conference_Location :
Berlin
ISSN :
1078-8743
Print_ISBN :
978-1-4244-3614-9
Electronic_ISBN :
1078-8743
Type :
conf
DOI :
10.1109/ASMC.2009.5155949
Filename :
5155949
Link To Document :
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