• DocumentCode
    2400587
  • Title

    Development of a multi — Electrode electrical stimulation device to improve chronic wound healing

  • Author

    Weber, Sonja.A. ; Vonhoff, Philipp A. ; Owens, Francis J. ; Byrne, J. Anthony ; McAdams, Eric T.

  • Author_Institution
    Nanotechnol. & Integrated Bioeng. Centre, Univ. of Ulster, Newtownabbey, UK
  • fYear
    2009
  • fDate
    3-6 Sept. 2009
  • Firstpage
    2145
  • Lastpage
    2148
  • Abstract
    A new device has been developed for the application of electrical stimulation to improve healing of chronic wounds. The device enables the creation of a composite electrode hence matching the electrode(s) to the size and shape of the wound. Up to 49 electrodes in an array can be combined, delivering High Voltage Pulsed Current (HVPC) in the range 60-120 Hz with a pulse duration range from 90-110 mus and the possibility of treating the patient with direct current instead of HVPC. In addition, the software can import the measurements from the ImpediMap device, analysing the electrical impedance of the tissues involved. A test on healthy volunteers did not prove a statistically significant rise in skin temperature, TcPO2 or impedance due to the stimulation, even though a slight reddening of the stimulated site was observed.
  • Keywords
    bioelectric phenomena; biomedical electrodes; biothermics; health care; patient treatment; skin; wounds; ImpediMap device; chronic wound healing; frequency 60 Hz to 120 Hz; health care; high voltage pulsed current; multielectrode electrical stimulation device; skin temperature; time 90 mus to 110 mus; tissue electrical impedance; wound size; wound treatment; Chronic Disease; Cicatrix; Electric Impedance; Electric Stimulation Therapy; Electrodes; Equipment Design; Humans; Muscle Contraction; Skin Temperature; Smallpox; Wound Healing; Wounds and Injuries;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Engineering in Medicine and Biology Society, 2009. EMBC 2009. Annual International Conference of the IEEE
  • Conference_Location
    Minneapolis, MN
  • ISSN
    1557-170X
  • Print_ISBN
    978-1-4244-3296-7
  • Electronic_ISBN
    1557-170X
  • Type

    conf

  • DOI
    10.1109/IEMBS.2009.5333963
  • Filename
    5333963