40% cycle time improvement as a result of continuous improvement activities

This paper describes an ongoing lean transformation in a Qimonda 300 mm Frontend Wafer-FAB, resulting in a 40% cycle time reduction so far. Chip delivery at higher reliability, decreased costs by waste reduction, shorter time to market and faster yield learning by shorter learning cycles are the major outcomes of the project. Key to success was the coordinated, orchestrated effort, involving all contributing functional areas at the site. Strong performance measures were introduced, which are followed up in the continuous improvement process.