DocumentCode
2400742
Title
Identifying key process characteristics and predicting etch rate from high-dimension datasets
Author
Ragnoli, E. ; McLoone, S. ; Lynn, S. ; Ringwood, J. ; Macgearailt, N.
Author_Institution
Dept. of Electron. Eng., NUI Maynooth, Maynooth, Ireland
fYear
2009
fDate
10-12 May 2009
Firstpage
106
Lastpage
111
Abstract
In semiconductor manufacturing advanced process control (APC) refers to a range of techniques that can be used to improve process capability. As the dimensions of electronic devices have decreased, the application of APC has become more and more important for the critical stages of production processes. However, the economic disadvantage of employing APC is that it requires feedback information in the form of downstream metrology data, which is both time consuming and costly to obtain.
Keywords
etching; integrated circuit manufacture; process control; process monitoring; semiconductor technology; etch rate; high dimension datasets; semiconductor manufacturing advanced process control; Etching; Manufacturing processes; Matrix decomposition; Metrology; Optical sensors; Plasma applications; Plasma measurements; Predictive models; Principal component analysis; Virtual manufacturing;
fLanguage
English
Publisher
ieee
Conference_Titel
Advanced Semiconductor Manufacturing Conference, 2009. ASMC '09. IEEE/SEMI
Conference_Location
Berlin
ISSN
1078-8743
Print_ISBN
978-1-4244-3614-9
Electronic_ISBN
1078-8743
Type
conf
DOI
10.1109/ASMC.2009.5155966
Filename
5155966
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