Title :
Identifying key process characteristics and predicting etch rate from high-dimension datasets
Author :
Ragnoli, E. ; McLoone, S. ; Lynn, S. ; Ringwood, J. ; Macgearailt, N.
Author_Institution :
Dept. of Electron. Eng., NUI Maynooth, Maynooth, Ireland
Abstract :
In semiconductor manufacturing advanced process control (APC) refers to a range of techniques that can be used to improve process capability. As the dimensions of electronic devices have decreased, the application of APC has become more and more important for the critical stages of production processes. However, the economic disadvantage of employing APC is that it requires feedback information in the form of downstream metrology data, which is both time consuming and costly to obtain.
Keywords :
etching; integrated circuit manufacture; process control; process monitoring; semiconductor technology; etch rate; high dimension datasets; semiconductor manufacturing advanced process control; Etching; Manufacturing processes; Matrix decomposition; Metrology; Optical sensors; Plasma applications; Plasma measurements; Predictive models; Principal component analysis; Virtual manufacturing;
Conference_Titel :
Advanced Semiconductor Manufacturing Conference, 2009. ASMC '09. IEEE/SEMI
Conference_Location :
Berlin
Print_ISBN :
978-1-4244-3614-9
Electronic_ISBN :
1078-8743
DOI :
10.1109/ASMC.2009.5155966
