• DocumentCode
    2400742
  • Title

    Identifying key process characteristics and predicting etch rate from high-dimension datasets

  • Author

    Ragnoli, E. ; McLoone, S. ; Lynn, S. ; Ringwood, J. ; Macgearailt, N.

  • Author_Institution
    Dept. of Electron. Eng., NUI Maynooth, Maynooth, Ireland
  • fYear
    2009
  • fDate
    10-12 May 2009
  • Firstpage
    106
  • Lastpage
    111
  • Abstract
    In semiconductor manufacturing advanced process control (APC) refers to a range of techniques that can be used to improve process capability. As the dimensions of electronic devices have decreased, the application of APC has become more and more important for the critical stages of production processes. However, the economic disadvantage of employing APC is that it requires feedback information in the form of downstream metrology data, which is both time consuming and costly to obtain.
  • Keywords
    etching; integrated circuit manufacture; process control; process monitoring; semiconductor technology; etch rate; high dimension datasets; semiconductor manufacturing advanced process control; Etching; Manufacturing processes; Matrix decomposition; Metrology; Optical sensors; Plasma applications; Plasma measurements; Predictive models; Principal component analysis; Virtual manufacturing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Advanced Semiconductor Manufacturing Conference, 2009. ASMC '09. IEEE/SEMI
  • Conference_Location
    Berlin
  • ISSN
    1078-8743
  • Print_ISBN
    978-1-4244-3614-9
  • Electronic_ISBN
    1078-8743
  • Type

    conf

  • DOI
    10.1109/ASMC.2009.5155966
  • Filename
    5155966