DocumentCode :
2400937
Title :
Increasing yields with in-tool ionization
Author :
Steinman, Arnold
Author_Institution :
1321 Walnut Street, Berkeley California 94709 USA
fYear :
2009
fDate :
10-12 May 2009
Firstpage :
164
Lastpage :
168
Abstract :
Smaller feature dimensions of semiconductor devices mean that ldquokiller particlerdquo sizes are also smaller. Static charge affects process yields by increased attraction of these smaller particles to critical product surfaces. This paper describes a study that establishes the affect of charge neutralization in reducing Particles per Wafer Pass (PWP). Cost of ownership analysis shows the positive results on yield and return on investment (ROI).
Keywords :
electrostatics; ionisation; semiconductor device manufacture; semiconductor devices; charge neutralization; feature dimensions; in-tool ionization; particles per wafer pass; process yield; semiconductor devices; static charge; Charge transfer; Contamination; Costs; Electrostatic discharge; Ionization; Metrology; Monitoring; Production; Qualifications; Statistical analysis;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Advanced Semiconductor Manufacturing Conference, 2009. ASMC '09. IEEE/SEMI
Conference_Location :
Berlin
ISSN :
1078-8743
Print_ISBN :
978-1-4244-3614-9
Electronic_ISBN :
1078-8743
Type :
conf
DOI :
10.1109/ASMC.2009.5155976
Filename :
5155976
Link To Document :
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