• DocumentCode
    2401159
  • Title

    Sensium: an ultra-low-power wireless body sensor network platform: Design & application challenges

  • Author

    Wong, A.C.W. ; McDonagh, D. ; Omeni, O. ; Nunn, C. ; Hernandez-Silveira, M. ; Burdett, A.J.

  • Author_Institution
    Toumaz Technol. Ltd., Abindgon, UK
  • fYear
    2009
  • fDate
    3-6 Sept. 2009
  • Firstpage
    6576
  • Lastpage
    6579
  • Abstract
    In this paper we present a system-on-chip for wireless body sensor networks, which integrates a transceiver, hardware MAC protocol, microprocessor, IO peripherals, memories, ADC and custom sensor interfaces. Addressing the challenges in the design, this paper will continue to discuss the issues in the applications of this technology to body worn monitoring for real-time measurement of ECG, heart rate, physical activity, respiration and/or skin temperature. Two application challenges are described; the real-time measurement of energy expenditure using the LifePebble, and; the development issues surrounding the `Digital Patch´.
  • Keywords
    access protocols; analogue-digital conversion; biomedical communication; biomedical electronics; biomedical measurement; body area networks; digital signal processing chips; electrocardiography; medical signal processing; microprocessor chips; patient monitoring; system-on-chip; transceivers; wireless sensor networks; ADC; ECG; IO peripherals; LifePebble; Sensium; body worn monitoring; digital patch; energy expenditure; hardware MAC protocol; heart rate; memories; microprocessor; physical activity; real-time measurement; respiration; skin temperature; system-on-chip; transceiver; ultra-low-power wireless body sensor network; Artifacts; Electric Power Supplies; Electrocardiography; Electrodes; Electromagnetic Fields; Electronics; Energy Metabolism; Equipment Design; Humans; Monitoring, Physiologic; Static Electricity; Telemetry;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Engineering in Medicine and Biology Society, 2009. EMBC 2009. Annual International Conference of the IEEE
  • Conference_Location
    Minneapolis, MN
  • ISSN
    1557-170X
  • Print_ISBN
    978-1-4244-3296-7
  • Electronic_ISBN
    1557-170X
  • Type

    conf

  • DOI
    10.1109/IEMBS.2009.5334001
  • Filename
    5334001